|
|
| ชื่อแบรนด์: | Winsmart |
| หมายเลขรุ่น: | SMTL300 |
| MOQ: | 1 ชุด |
| ราคา: | USD1-150K/set |
| รายละเอียดบรรจุภัณฑ์: | กรณีไม้อัด |
| เงื่อนไขการชำระเงิน: | L/C,T/T,เวสเทิร์นยูเนี่ยน |
300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine
UV Laser PCB Depaneling Machine Overview:
A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.
UV Laser PCB Depaneling Machine Features:
300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.
UV Laser PCB Depaneling Machine Specifications:
| Model | SMTL300, dual tables |
| Power | 380V AC, 50Hz, 20A |
| Compressed Air | Compressed air |
| Machine Dimension | 1450(L)x1350(W)x1665(H)mm |
| Installation Space | 3000x3000x2500mm |
| Machine Weight | 800kgs |
| Ambient Temperature | 22 ~ 25 ℃ |
| temperature variation | within ± 1 ℃ / 24hr |
| ambient humidity | within 40% ~ 70% (no obvious condensation is allowed) |
| Dust free grade | 100000 or better |
| power consumption | 6KW |
| Cutting width | ≤ 50mm × 50mm |
| Cutting materials | full cut / half cut of PCB / FPC, LCP / glue and other related materials |
| Cutting thickness | ≤ 3mm |
| Cutting speed | ≤ 3000mm / S |
| Overall machining accuracy | ≤ 30um |
| Processing pattern | straight line, slash, curve, abnormity, etc |
| Laser | 355nm light wave nanosecond laser |
| Repetition frequency | 50-150khz |
| Laser Power | UV 15W@30KHz |
| Pulse width | < 20ns |
| Energy stability | < 3% RMS over 8hours |
| Beam quality m ² | < 1.3 |
| Mode | 2500mm/S |
| Warranty | 1 year |
| Service | Oversea training is available |
UV Laser PCB Depaneling Machine Advantages:
UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.
It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.
UV Laser PCB Depaneling Machine Applications:
Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling
|
| ชื่อแบรนด์: | Winsmart |
| หมายเลขรุ่น: | SMTL300 |
| MOQ: | 1 ชุด |
| ราคา: | USD1-150K/set |
| รายละเอียดบรรจุภัณฑ์: | กรณีไม้อัด |
| เงื่อนไขการชำระเงิน: | L/C,T/T,เวสเทิร์นยูเนี่ยน |
300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine
UV Laser PCB Depaneling Machine Overview:
A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.
UV Laser PCB Depaneling Machine Features:
300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.
UV Laser PCB Depaneling Machine Specifications:
| Model | SMTL300, dual tables |
| Power | 380V AC, 50Hz, 20A |
| Compressed Air | Compressed air |
| Machine Dimension | 1450(L)x1350(W)x1665(H)mm |
| Installation Space | 3000x3000x2500mm |
| Machine Weight | 800kgs |
| Ambient Temperature | 22 ~ 25 ℃ |
| temperature variation | within ± 1 ℃ / 24hr |
| ambient humidity | within 40% ~ 70% (no obvious condensation is allowed) |
| Dust free grade | 100000 or better |
| power consumption | 6KW |
| Cutting width | ≤ 50mm × 50mm |
| Cutting materials | full cut / half cut of PCB / FPC, LCP / glue and other related materials |
| Cutting thickness | ≤ 3mm |
| Cutting speed | ≤ 3000mm / S |
| Overall machining accuracy | ≤ 30um |
| Processing pattern | straight line, slash, curve, abnormity, etc |
| Laser | 355nm light wave nanosecond laser |
| Repetition frequency | 50-150khz |
| Laser Power | UV 15W@30KHz |
| Pulse width | < 20ns |
| Energy stability | < 3% RMS over 8hours |
| Beam quality m ² | < 1.3 |
| Mode | 2500mm/S |
| Warranty | 1 year |
| Service | Oversea training is available |
UV Laser PCB Depaneling Machine Advantages:
UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.
It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.
UV Laser PCB Depaneling Machine Applications:
Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling
ที่อยู่
สวนอุตสาหกรรม Liwu เมือง Yuanzhou เขต Boluo เมือง Huizhou มณฑลกวางตุ้งประเทศจีน
โทรศัพท์
86-138-29839112
อีเมล
info@smtfullsolution.com
